Designs, develops, and supplies semiconductors and infrastructure software for data center, networking, broadband, wireless and storage markets.
The engineer will drive manufacturing excellence and uphold the highest quality standards, becoming a Broadcom product and electromechanical manufacturing expert. Responsibilities include being the first point of contact for sustaining product, process and quality concerns, owning the end‑to‑end product quality lifecycle, coordinating failure analyses with global partners, creating and validating BOM structures in Oracle PLMC, reviewing physical FAIs, authoring product deviations, supporting OEM launches, leading cross‑functional RCCA meetings, and participating in NPI phases with DFX feedback and cost‑reduction initiatives.
Essential qualifications include a minimum of eight years of manufacturing or product engineering experience and a BS in Engineering (MBA or MS preferred). Candidates must have comprehensive knowledge of electromechanical assembly and testing, expertise in PCBA manufacturing, system integration, and field‑return repair, as well as proficiency with SKU and BOM lifecycle tools such as PLMC. Experience with new product introductions, design collaboration, contract manufacturing, DFX concepts, quality metrics, strong business communication, critical decision‑making with limited data, and managing multiple projects simultaneously is required.
The position offers a base salary range of $88,300 to $141,300, eligibility for a discretionary annual bonus and equity awards, and a comprehensive benefits package that includes medical, dental and vision plans, 401(k) matching, an employee stock purchase program, employee assistance program, paid holidays, sick leave, vacation and paid family leave.