Director Of Hardware Engineering

Description

• Direct full product lifecycle execution: requirements, architecture, detailed design, prototype build, environmental/radiation/EMI-EMC qualification, manufacturing introduction and spacecraft integration.
• Partner closely with system engineering, software/firmware, GNC, payload/instrument, and operations to ensure coherent hardware-software interaction, robust performance, and smooth delivery.
• Support engagement with customers, suppliers, and subcontractors throughout the product development life cycle.
• Proactively collaborate with Program Management Office to manage schedules, budgets, risk mitigation, and resource plans to meet mission performance and reliability targets.
• Lead the definition of hardware system architecture for electronically-steered radar subsystems including electronically steered antennas, RF front-ends, power electronics, high-speed digital and mixed-signal electronics, and embedded processing hardware.
• Recruit, hire, manage and mentor cross-disciplinary engineering teams, guiding execution, staffing, team growth, and culture of ownership and innovation.
• In conjunction with Program Management Office, drive manufacturability, cost efficiency, and quality through DFX (Design for Excellence) principles and NPI hand-off to production partners.

Requirements

• Excellent communication skills, with ability to present to senior leadership and collaborate with customers and suppliers.
• Technical depth in RF/Microwave, Antenna systems, Radar, high-speed digital and mixed-signal electronics and power electronics.
• Significant experience developing mission-critical hardware for space and/or defense environments.
• Proven success qualifying hardware for environmental and radiation conditions and supporting spacecraft/field deployments.
• Significant experience as a principal-level individual contributor working with multi-disciplinary engineering teams delivering complex spaceborne hardware.
• 4-5+ years in leadership/management of engineering teams across hardware disciplines.
• Experience with PCB design, EMI/EMC practices, and mechanical/thermal packaging for high-reliability hardware.
• BS/MS, or PhD in Physics, Electrical Engineering, Aerospace Engineering, or equivalent discipline.
• Must be eligible to obtain and hold a US DoD security clearance (TS with SCI).
• Own hardware V&V and TRL-advancement strategy: signal/power integrity analysis, reliability modeling, and environmental testing (thermal, vibration, shock, vacuum, EMI/EMC, radiation).
• Demonstrated understanding of program planning, budget control, schedule execution, risk management, and cross-functional resource management.

Benefits

• Employee Assistance Program
• Medical, dental & vision
• Transportation benefits
• Time Off/Leave (PTO, Vacation or Sick Leave)
• Insurance (Basic/Supplemental Life & AD&D)
• Short and long-term disability
• Health & Dependent Care Spending Accounts (HSA & DCFSA)

Training + Development

Interview process

Visa Sponsorship

Security clearance