Collaborate with the Responsible Engineer to define and maintain board-level architecture, layer stack-ups, and routing strategies ensuring signal integrity, impedance control, and EMI/EMC compliance.
Execute detailed component placement and routing for complex multi-layer designs including high-density BGAs, SERDES, DDR, FPGA, and high-frequency RF interconnects.
Coordinate with Contract Design Services partners to ensure alignment with internal engineering standards and deliverables.
Participate in formal design reviews, enforce design rules, and ensure documentation packages meet aerospace and defense standards.
Serve as the point of contact for standardized PCB layout, DFM/DFA/DFT rules, ECAD constraint management, and centralized component-library oversight.
Support PCB fabrication and assembly vendors DFM and inquiries, ensuring compliance with stack-up, impedance, and material specifications for space/defense environments.
Own the full lifecycle design, from schematic collaboration and layout execution through fabrication, assembly, and bring-up support.
Integrate board design within mechanical, RF, thermal, and system-level constraints, ensuring mechanical compatibility, manufacturability, and serviceability.
Design and layout high-speed digital, mixed-signal, RF front-end, and power management boards supporting spaceborne radar payloads and phased-array antenna modules.
Contribute to supply-chain readiness and material qualification efforts for high-reliability boards.