Lead Power Electronics Integration Engineer

Description

• Support project delivery by ensuring designs meet cost, schedule, and quality objectives.
• Undertake detailed circuit design activities, including snubber networks, gate drivers, and protection circuitry, applying expertise in semiconductor devices (Diodes, Thyristors, IGBTs, GTOs, IGCTs, MOSFETs, SiC, GaN, etc.).
• Specify, design, and document power electronic converter solutions tailored to system and customer requirements.
• Work on exciting cutting-edge technology on novel drive system topologies and challenging and exciting global projects.
• Lead or support thermal and structural analysis, including simulation, validation, and environmental testing to confirm performance in demanding operational conditions.
• Plan and oversee testing, verification, and validation of LV and MV converter hardware, ensuring compliance with design intent and reliability standards.
• Ensure adherence to engineering standards, health and safety regulations, and relevant international and class society requirements (e.g., Lloyd’s Register, DNV).
• Lead the full lifecycle of electromechanical packaging design for power converters and enclosures, integrating power electronics, mechanical, thermal, and electrical aspects to deliver robust, manufacturable solutions.
• Provide technical support to tendering, testing, and commissioning teams as needed.
• Develop and enhance analytical and modelling tools for MW-class converter systems, including studies in thermal behaviour, EMC, harmonics, common-mode effects, and performance optimization.
• Collaborate closely with CAD engineers, electrical designers, and system architects to achieve optimal component placement, cooling efficiency, and structural integrity.
• Manage BOM control and ensure traceability of design changes in accordance with robust configuration management practices.
• Conduct modelling, analysis, and simulation of power converter systems using tools such as MATLAB/Simulink, PLECS, PSpice, Mathcad, CFD, or equivalent.
• Drive Design for Manufacturing (DfM) and Design for Assembly (DfA) initiatives, ensuring scalable, cost-effective, and high-reliability designs.

Requirements

• Strong communication, leadership, and stakeholder management skills.
• Proven ability to lead multidisciplinary engineering teams and manage technical deliverables across complex projects.
• Able to achieve UK security clearance.
• Degree (Beng or Meng or PhD) in Electrical, Electronics, or Mechanical Engineering (or related discipline).
• Familiarity with industry standards and regulatory frameworks for high-power electronic systems.
• Strong personal organisational skills, ability to manage time effectively, monitors performance against deadlines and milestones, works productively in a pressurised environment.
• Willing to travel within UK and overseas for short term working.
• Proficiency in design and simulation tools (e.g., EPLAN, MATLAB/Simulink, PLECS, ANSYS, SolidWorks).
• Strong background in thermal management, mechanical design, and power semiconductor applications.
• Strong report writing skills; writes clearly and succinctly to meet the needs and understanding of the intended audience.
• Extensive experience in power electronics converter design and packaging for high-power systems (LV/MV).

Benefits

• Attractive compensation.
• 26 days vacation + bank holidays.
• Flexible benefits so you can build a package that fits your personal needs. Some core benefits are: Employer pension contribution (not subject to individual contribution), Income protection, Private Health Insurance and Life Assurance.
• Opportunities for professional growth and career advancement in a global company.
• A work environment where we understand that not everyone has the same expectations about their jobs, careers and work-life balance and we are happy to discuss flexibility requirements.
• Dynamic and collaborative work environment with a focus on innovation and creativity.

Training + Development

Interview process

Visa Sponsorship

Security clearance