Power Electronics Packaging Engineer

Description

In this role, you will have the opportunity to develop and verify your ideas to enhance the performance of next-generation power modules across various applications. These applications include on-board charging converters, EV traction inverters, charging stations, wind and solar inverters, SSTs and energy storage. Collaboration with global teams, interaction with suppliers, conference participation, and research publication in technical venues will also be part of your journey.

• Propose new concepts to enhance power module electrical, EMI immunity and thermal performances
• Propose novel next generation high density inverter solutions for traction applications
• Manufacturing process for molding, soldering, wire bonding, sintering, encapsulation, etc…
• Build and maintain technical competency in power electronics packaging technologies
• Design, build and verify selected new package concepts and technologies using state-of-the-art multi-physics simulation tools
• Translate application requirements into power semiconductor module specifications
• Research new approaches to improve the following aspects in the power modules: parasitic components, e-field distribution, insulation, partial discharge, thermal performance, die attach, interconnects, mechanical fatigue, etc…
• Propose low-cost and ultra-fast gate driver short circuit protection / driving solutions and overall optimization
• Interact with chip makers and material suppliers

Requirements

Delta Electronics (Americas) Ltd. is seeking a power electronics engineer with expertise in power module packaging to join our advanced Milan M. Jovanović Power Electronics Lab, located in Research Triangle Park, NC. Your motivation, creativity, and results-oriented attitude will contribute to achieving our mission: providing innovative, clean, and energy-efficient solutions for a better tomorrow.

• CAD and CFD simulation tools (SolidWorks, Flotherm, etc…)
• M.S. or Ph.D. degree in Electrical Engineering
• ANSYS simulation (Maxwell, Q3D, etc)
• Candidates should possess excellent analytical, organizational, interpersonal, and communication skills. You must be self-motivated and able to work independently as well as a member of a team
• Power electronics concepts (topologies, building blocks, parasitic effects, EMI, losses, partial discharge, etc…)
• Power semiconductor devices (SiC MOSFETS, SiC diodes, Si IGBTs, GaN, BidFETs etc.)

Benefits

Training + Development

Interview process

Visa Sponsorship

Security clearance